Thin film filter
Bandwidth3.1-4.7GHz, Rejection30@DC-2.6GHz, 30@5.6-9.0GHz
- STBP3R9-1R6-M637
- China
- One Year
- +86-19938031308
- sales@com-mw.com, cynthia@com-mw.com
- 3-1-2306, No.37 Jiancai Road, Chenghua Zone, Chengdu
- For qty details, please search in spot products of dianzibuy. Any changes to the contents are not notified. Please confirm again before ordering.
- No restrictions on export to any country
- RoHS compliant (Meet RoHS standards can be customized)
Product Details
Product features
High precision machining technology
Low temperature drift, high power.
Ceramic substrate, 50 Ω coplanar waveguide
Gold wire bonding
Tech specifications
| Items | Parameters | Units |
| Center Frequency | 3.9 | GHz |
| Bandwidth | 3.1-4.7 | GHz |
| Center loss | 2.7 | dB |
| Ripple | 1.0 | dB |
| VSWR | 1.7:1 | |
| Group delay ripple | 0.7 | ns |
| Rejection | 30@DC-2.6GHz | dBc |
| Rejection | 30@5.6-9.0GHz | dBc |
Other requirement (Design assurance)
| power | 2W CW |
| Work Temp. | -55~+85℃ |
| Storage Temp. | -55~+125℃ |
| Outline size | L:6.5，W:7.5，h:0.39 |
Outline drawing: Port centered
Suggested PCB Layout
Note
1: 0.1mm from the side wall, 2.75mm from the surface to the upper cover.
2: Suggest using conductive adhesive for bonding;
3: The chip should be installed on kovar alloy or molybdenum copper;
4: Suggest using a T-shaped structure for microstrip bonding.
Schematic diagram
Typical test curve
