Power divider
6~18GHz, 2W, 2way, Phase0°
- ZPD8-2M6-18G-2616
- China
- One Year
- +86-19938031308
- sales@com-mw.com, cynthia@com-mw.com
- 3-1-2306, No.37 Jiancai Road, Chenghua Zone, Chengdu
- For qty details, please search in spot products of dianzibuy. Any changes to the contents are not notified. Please confirm again before ordering.
- No restrictions on export to any country
- RoHS compliant (Meet RoHS standards can be customized)
Product Details
Product features
Broadband, small volume.
Main specifications
| Parameters | Min | Typical | Max | Units |
| Frequency | 6 | ~ | 18 | GHz |
| IL | 0.5 | dB | ||
| Isolation | 20 | dB | ||
| Input VSWR | 1.5 | |||
| Output VSWR | 1.5 | |||
| Amplitude balance | 0.2 | dB | ||
| Phase balance | ±3 | ° |
Other parameters
| Power | 2W Design assurance |
| way | 2-way |
| Phase | 0° |
| Impedance | 50Ω |
| Connector | Microstrip pad |
| Work Temp. | -55~+85℃ |
| Storage Temp. | -55~+125℃ |
| Quality Grade | Industrial grade |
| Other | Thin film ceramics |
Port Definition
| Common port | 0 |
| Dispatch Port | 1，2 |
Reference picture
Configuration(mm)
Note
| 1 | The chip is recommended to be used in separate cavities, with a distance of 0.1mm from the sidewall on one side and a distance of 1-2mm from the upper cover on the surface. |
| 2 | Low stress conductive adhesive (ME8456) is recommended for bonding chips. |
| 3 | The chip should be installed on a carrier such as molybdenum copper, which is close to the thermal expansion coefficient of ceramics (6.7ppm/C °), with a carrier thickness of ≥ 0.2mm. |
| 4 | 电路板微带线与芯片键合连接时，建议微带键合处采用T型结构进行匹配，尺寸如下: |