Thin film filter
PassbandDC-3.2, 4.0-12.0, Rejection30@3.6GHz
- STRP3R6-0R0-M231
- China
- One Year
- +86-19938031308
- sales@com-mw.com, cynthia@com-mw.com
- 3-1-2306, No.37 Jiancai Road, Chenghua Zone, Chengdu
- For qty details, please search in spot products of dianzibuy. Any changes to the contents are not notified. Please confirm again before ordering.
- No restrictions on export to any country
- RoHS compliant (Meet RoHS standards can be customized)
Product Details
Product features
High precision machining technology
Low temperature drift, high power.
Ceramic substrate, 50 Ω coplanar waveguide
Gold wire bonding
Tech specifications
| Items | Parameters | Units |
| Passband | DC-3.2 | GHz |
| 带宽通带 | 4.0-12.0 | GHz |
| 损耗通带 | 3.0 | dB |
| Ripple | 3.0 | dB |
| VSWR | 2.0:1 | |
| Group delay ripple | 0.8 | ns |
| Rejection | 30@3.6GHz | dBc |
Other requirement (Design assurance)
| power | 1W CW |
| Work Temp. | -55~+85℃ |
| Storage Temp. | -55~+125℃ |
| Outline size | L:13.9，W:4.0，h:0.26 |
Outline drawing: Port centered
Suggested PCB Layout
Note
1: 0.1mm from the side wall, 1.75mm from the surface to the upper cover.
2: Suggest using conductive adhesive for bonding;
3: The chip should be installed on kovar alloy or molybdenum copper;
4: Suggest using a T-shaped structure for microstrip bonding.
Schematic diagram
Typical test curve
