Bandwidth2.3-2.7GHz, Rejection40@DC-1.75GHz, 40@3.5-4.0GHz
High precision machining technology
Low temperature drift, high power.
Ceramic substrate, 50 Ω coplanar waveguide
Gold wire bonding
Items | Parameters | Units |
Center Frequency | 2.5 | GHz |
Bandwidth | 2.3-2.7 | GHz |
Center loss | 2.0 | dB |
Ripple | 1.0 | dB |
VSWR | 1.7:1 | |
Group delay ripple | 0.5 | ns |
Rejection | 40@DC-1.75GHz | dBc |
Rejection | 40@3.5-4.0GHz | dBc |
power | 2W CW |
Work Temp. | -55~+85℃ |
Storage Temp. | -55~+125℃ |
Outline size | L:7.0,W:8.0,h:0.39 |
1: 0.1mm from the side wall, 2.75mm from the surface to the upper cover.
2: Suggest using conductive adhesive for bonding;
3: The chip should be installed on kovar alloy or molybdenum copper;
4: Suggest using a T-shaped structure for microstrip bonding.