Power divider

34~54GHz, 1W, 2way, Phase0°

  • ZPD8-2M34-54G-2551
  • China
  • One Year
  • +86-19938031308
  • sales@com-mw.com, cynthia@com-mw.com
  • 3-1-2306, No.37 Jiancai Road, Chenghua Zone, Chengdu
  • For qty details, please search in spot products of dianzibuy. Any changes to the contents are not notified. Please confirm again before ordering.
  • No restrictions on export to any country
  • RoHS compliant (Meet RoHS standards can be customized)

Product Details

DATASHEET
PCB LAYOUT
S-PARAMETERS

Main specifications

ParametersMinTypicalMaxUnits
Frequency34~54GHz
IL0.8dB
Isolation20dB
Input VSWR1.5
Output VSWR1.5
Amplitude balance0.4dB
Phase balance±6°

Other parameters

Power1W Design assurance
way2-way
Phase0°
Impedance50Ω
ConnectorMicrostrip pad
Work Temp.-40~+85℃ Design assurance
OtherThin film ceramics

Port Definition

Common port0
Dispatch Port1，2

Suggested PCB Layout

Typical test data

Frequency(GHz)S11 VSWRS12 Loss dBS13 IL dBS23 RejectionS13 Phase (°)
32.141.27-4.21-4.09-17.310.56
34.291.05-3.34-3.39-19.46
36.431.17-3.4-3.22-21.030.39
38.571.19-3.32-3.22-23.44-1.98
40.711.42-3.63-3.69-28.12-2.31
42.861.4-3.48-3.73-25.64-2.67
451.45-3.61-3.72-25.57-1.41
47.141.49-3.63-3.56-27.97-3.45
49.291.39-3.37-3.52-26.87-3.91
51.431.27-3.47-3.56-23.45-4.57
53.571.33-3.36-3.56-22.87-4.41
55.711.71-3.81-4.02-30.34-4.38

Reference picture

Configuration(mm)

Typical test curve

Note

1The chip is recommended to be used in separate cavities, with a distance of 0.1mm from the sidewall on one side and a distance of 1-2mm from the upper cover on the surface.
2Low stress conductive adhesive (ME8456) is recommended for bonding chips.
3The chip should be installed on a carrier such as molybdenum copper, which is close to the thermal expansion coefficient of ceramics (6.7ppm/C °), with a carrier thickness of ≥ 0.2mm.
4When the Microstrip of the circuit board is bonded to the chip, it is recommended to use a T-shaped structure at the microstrip bonding point for matching.